| PART |
Description |
Maker |
| HD404092H HD404092S HD4074054S HD4074094H HD407409 |
microcomputer designed to increase program productivity
|
Renesas Electronics Corporation
|
| IM512-L6A |
chance for integrating various power and control components to increase reliability
|
Infineon Technologies A...
|
| STW9B12C |
Thermally Enhanced Package Design
|
Seoul Semiconductor
|
| PDZ16B PDZ3.6B PDZ3.0B PDZ3.3B |
Small plastic package suitable for surface mounted design
|
TY Semiconductor Co., Ltd
|
| IS1U60L IS1U60 |
Sensors with 1-Package Design of Remote Control Detecting Functions owing to OPIC
|
Sharp Corporation
SHARP[Sharp Electrionic Components]
|
| HVD355B |
Super small Flat Lead Package (SFP) is suitable for surface mount design
|
TY Semiconductor Co., Ltd
|
| AD7705BRU AD7706 EVAL-AD7706EB EVAL-AD7705EB AD770 |
3 V/5 V, 1 mW 2-/3-Channel 16-Bit, Sigma-Delta ADCs 3 5伏，1毫瓦2-/3-Channel 16位Δ模数转换
Precision Zero-Drift Operational Amplifier with Internal Capacitors; Package: SO; No of Pins: 8; Temperature Range: 0°C to 70°C 3 5毫瓦2-/3-Channel 16位Δ模数转换器（264.12十一
ECONOLINE: REC2.2-S_DR/H1 - 2.2W DIP Package- 1kVDC Isolation- Regulated Output- UL94V-0 Package Material- Continuous Short Circiut Protection- Internal SMD design- 100% Burned In- Efficiency to 75%
3 V/5 V/ 1 mW 2-/3-Channel 16-Bit/ Sigma-Delta ADCs
|
http://
Analog Devices, Inc.
|
| UPD65530 UPD65510 UPD65565 UPD65567 UPD65507 |
ANACONDA LT TRANSCEIVER
CMOS Gate Array.Embedded Array Ver.2.0 for Package | Design Manual[05/2003] CMOS门阵列Array.Embedded的包版本2.0 |设计手册[05/2003]
|
TE Connectivity, Ltd.
Vishay Intertechnology, Inc.
|
| BCM94317 BCM94309-M |
AirForce One™ Single-Chip 802.11b Transceiver Reference Design
802.11a/b/54g™ Dual-Band Client Reference Design
|
Broadcom
|
| AD7810 AD7810YN AD7810YR AD7810YRM |
2.7 V to 5.5 V, 2 us, 10-Bit ADC in 8-Lead microSOIC/DIP
2.7 V to 5.5 V 2 us 10-Bit ADC in 8-Lead microSOIC/DIP
ECONOLINE: REC2.2-S_DR/H1 - 2.2W DIP Package- 1kVDC Isolation- Regulated Output- UL94V-0 Package Material- Continuous Short Circiut Protection- Internal SMD design- 100% Burned In- Efficiency to 75%
2.7 V to 5.5 V/ 2 us/ 10-Bit ADC in 8-Lead microSOIC/DIP
|
AD[Analog Devices]
Analog Devices, Inc.
|
| ST16N10 |
TO-252 Package design
|
Stanson Technology
|
| ST03N20 |
SOT-89 package design
|
Stanson Technology
|
